According to a new market research report published by Credence Research Semiconductor Wafer Cleaning Equipment Market (Equipment Type Wet Stations, Scrubbers and Single Wafer Processing Equipment; Operation Type Rotary Wafer Etching System and Manual Wet Batch System) Growth, Future Prospects and Competitive Analysis, 2017 - 2025, the global semiconductor wafer cleaning equipment market is set to expand with a CAGR of 6.8% through the forecast period of 2017 to 2025.

Browse the full report at http://www.credenceresearch.com/report/semiconductor-wafer-cleaning-equipment-market

Market Insights

Integrated circuits (IC) manufacturing involves numerous precise processing phases depending upon the device type. Majority of these steps are accomplished as single process on the entire wafer prior to dicing into individual chips. Nearly 20% of the overall steps are wafer cleaning processes, making semiconductor wafer cleaning among the most important processes in semiconductor manufacturing. Semiconductor wafer cleaning equipment are used in semiconductor production for cleaning chemical as well as particle impurities without affecting the wafer surface.

The overall semiconductor wafer cleaning equipment market is highly fuelled by the consistently rising electronics and semiconductor industry worldwide. Due to ongoing advancement in the industry towards high performance and miniaturized devices, it becomes highly essential to maintain the silicon wafers free from contamination. With the rising demand for high performance electronic devices, the wafer cleaning equipment industry is projected to continue demonstrating strong growth in the following years. The market growth is primarily governed by the Asia Pacific region, owing to its huge semiconductor and electronics manufacturing sector.

The overall semiconductor wafer cleaning equipment market is segmented on the basis of equipment type and operation type. On the basis of equipment type, the market is segmented into wet stations, scrubbers and single wafer processing equipment. Based on the operation type, the market is categorized into rotary wafer etching system and manual wet batch system. As of 2016, the overall semiconductor wafer cleaning equipment market is dominated by the rotary wafer etching system segment, accounting for more than sixty percent of the total market revenue.

On the basis of geographic regions, the market is classified into North America, Europe, Asia Pacific and rest of the world (RoW). As of 2016, the overall semiconductor wafer cleaning equipment market is led by the Asia Pacific region, followed by Europe. In the following years, Asia Pacific is set to continue dominating the overall semiconductor wafer cleaning equipment. The demand for semiconductor wafer cleaning equipment here is primarily governed by China, Taiwan, South Korea and Japan, having huge electronics and semiconductor manufacturing industry.

Browse the full report at http://www.credenceresearch.com/report/semiconductor-wafer-cleaning-equipment-market

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A semiconductor material has an electrical conductivity value falling between that of a conductor such as copper, gold etc. and an insulator, such as glass. Their resistance decreases as their temperature increases, which is behavior opposite to that of a metal. Their conducting properties may be altered in useful ways by the deliberate, controlled introduction of impurities ("doping") into the crystal structure. Where two differently-doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers which include electrons, ions and electron holes at these junctions is the basis of diodes, transistors and all modern electronics. A wafer, also called a slice or substrate,[1] is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated (dicing) and packaged. Cleaning is the process of removing unwanted substances, such as dirt, infectious agents, and other impurities, from an object or environment. Cleaning occurs in many different contexts, and uses many different methods. Several occupations are devoted to cleaning. Source: Wikipedia

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